By integrating the display drive circuits onto the LCD glass substrate using VIT technology, it is possible to significantly reduce the number of connections with external circuits as compared to COG(*1) and COF(*2) designs that employ external drive circuits. This allows for higher image definition that is less affected by the connecting pitch to external drive circuits.
When taking the LCD into account as a full display module that includes a backlight system and external circuit board, the reduced number of components and connected lines results in a smaller, slimmer, more lightweight display as well as improved resistance against shock and vibration.
In the future, NEC LCD Technologies will aim for the realization of a Zero Chip Display, which can be directly coupled to the MPU bus line of the system by integrating the circuits necessary for display, such as the DC/DC converter, controller, interface circuit and image frame memory, onto the glass substrate.

(*1) COG（Chips On Glass）: Method of directly placing IC chips on glass substrate
(*2) COF（Chips On Film）: Method of directly placing IC chips on Flexible Film

【2.7" TFT color LCD module achieving
high definition of 413ppi.】

VIT is an abbreviation for Value Integrated TFT.