Due to the high electron mobility of the low-temperature polysilicon used in VIT(*) technology, high-speed peripheral circuits such as drive circuits can be integrated on the same glass substrate as the LCD.
In comparison with COG(*1) and COF(*2) designs that employ external drive circuits, this integrated approach significantly reduces the number of connections with external circuits and allows for higher image definition that is less affected by the connecting pitch to external drive circuits.
Taking into account the entire display module, including the backlight system and external circuit board, the reduced number of components and connected lines results in a smaller, slimmer, more lightweight display body as well as improved resistance against shock and vibration.
NEC LCD Technologies will continue its efforts to add further value to its LCDs by integrating still more functions on the glass substrate.

(*) VIT：Value Integrated TFT
(*1) COG（Chips On Glass）: Method of directly placing IC chips on glass substrate
(*2) COF（Chips On Film）: Method of directly placing IC chips on Flexible Film